首页> 外文会议>European Photovoltaic Solar Energy Conference and Exhibition >TEMPERATURE DEPENDENCE OF SLOW MINORITY CARRIER DE-TRAPPING IN CZOCHRALSKI SILICON WITH HIGH CONCENTRATIONS OF THERMAL DONORS
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TEMPERATURE DEPENDENCE OF SLOW MINORITY CARRIER DE-TRAPPING IN CZOCHRALSKI SILICON WITH HIGH CONCENTRATIONS OF THERMAL DONORS

机译:慢少数载体在Czochralski硅具有高浓度热施主的温度依赖性

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The slow de-trapping characteristics of defects related to thermal donors have been studied with transient photoconductance measurements in Cz monocrystalline silicon wafers. The temperature dependent photoconductance decay curves were analyzed to extract de-trapping time constants for a range of Cz-grown wafers. These included an as-cut wafer with a moderate concentration of pre-existing thermal donors, a wafer with a high concentration of thermal donors (High TD sample) which was annealed at 450°C for 72 hours, and a sample with no thermal donors (No TD sample) annealed at 650°C for 30 minutes to destroy the pre-existing thermal donors. The de-trapping time constants were measured at four temperatures (12°C, 30°C, 60°C and 80°C) using photoconductance decay measured up to 10 minutes after the illumination was turned off. We find that the de-trapping time constants of the as-cut sample are higher than those of the High TD sample for all the temperatures studied. Also, in both samples, the de-trapping time constants decrease with temperature, indicating that trapped minority carriers are released back into the bands more rapidly at higher temperatures. De-trapping was not observed in the samples without thermal donors. We also estimate the energy level of the significant traps using Arrhenius plots and found that in n-type Cz silicon, the as-cut wafers mostly contain traps close to the valence band, whereas the High TD sample has much deeper traps.
机译:已经研究了与热量供体相关的缺陷的慢捕获特性,CZ单晶硅晶片中的瞬态光电电导光测量。分析温度依赖性光电导衰减曲线以提取一系列CZ生长晶片的脱捕时间常数。这些包括具有中等浓度的预先存在的热量供体的晶片,具有高浓度的热量供体(高Td样品)的晶片,其在450℃下在450℃下退火72小时,以及没有热供体的样品(没有Td样品)在650℃下退火30分钟以破坏预先存在的热量供体。使用光电导衰减在截止后,在40℃(12℃,30℃,60℃和80℃)下测量去捕获时间常数。我们发现消减样品的去捕获时间常数高于研究的所有温度的高TD样品。而且,在两个样品中,去捕获时间常数随温度降低,表明捕获的少数载流子在较高温度下更快地释放回带中的带。在没有热量供体的样品中未观察到去捕获。我们还估计了使用Arrhenius图的重要陷阱的能量水平,发现在N型CZ硅中,割晶晶片主要含有靠近价带的陷阱,而高TD样品具有更深的陷阱。

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