首页> 外文会议>The 16th International Conference on olid-State Sensors, Actuators and Microsystems >Polymer MEMS fabrication process for self-assembled millimeter-wave on-chip antennas
【24h】

Polymer MEMS fabrication process for self-assembled millimeter-wave on-chip antennas

机译:自组装毫米波片上天线的聚合物MEMS制造工艺

获取原文

摘要

A novel micro-electro-mechanical systems (MEMS) fabrication process for self-assembled antennas has been characterized. Self-assembled vertical monopole antennas were previously reported [1]. The vertical on-chip antennas provide higher efficiency over conventional planar on-chip antennas. However, the metallization step of the antennas was performed after the release and self-assembly of the devices resulting in minimal deposition of metal on the backside of the antennas. In the presented work, two separate metallization steps are performed before and after the structural layers are patterned to achieve an even thickness of metal layers on both the top and bottom surfaces of the antennas in order to reduce dielectric loss. Additionally, bridging structures are integrated between the stress-inducing blocks to further enhance self-assembled curvatures with a brief exposure of SU-8.
机译:已经表征了用于自组装天线的新颖的微机电系统(MEMS)制造工艺。自组装垂直单极天线以前已有报道[1]。垂直的片上天线提供了比传统的平面片上天线更高的效率。但是,天线的金属化步骤是在设备释放和自组装之后执行的,从而导致金属在天线背面的沉积最少。在提出的工作中,在对结构层进行构图之前和之后执行两个单独的金属化步骤,以在天线的顶表面和底表面上获得均匀厚度的金属层,以减少介电损耗。此外,在短时暴露于SU-8的情况下,桥接结构集成在应力产生块之间,以进一步增强自组装的曲率。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号