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Influence of the annealing on the thermal stability of Ge-Sb-Te materials for recording devices

机译:退火对记录装置用Ge-Sb-Te材料热稳定性的影响

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Phase change memory materials of Ge-Sb-Te system [(GeTe)_m(Sb_2Te_3)_n (m : n = 1:1; 1:2; 2:1)] were studied during thermal cycling by differential scanning calorimetry, and thermal properties were determined. Reproducible endothermic peak in the range of 390-415°C was revealed in Ge_2Sb_2Te_5, GeSb_2Te_4, GeSb_4Te_7, which may possibly influence on the kinetics and endurance of data reading processes in phase-change memory devices. The nature of this endothermic peak is discussed. It was shown that additional annealing of synthesized Ge_2Sb_2Te_5 increase stability of structure and thermal properties of the material.
机译:通过差示扫描量热法研究了热循环过程中Ge-Sb-Te体系的相变存储材料[(GeTe)_m(Sb_2Te_3)_n(m:n = 1:1; 1:2; 2:1)]。属性已确定。在Ge_2Sb_2Te_5,GeSb_2Te_4,GeSb_4Te_7中发现了在390-415°C范围内可再现的吸热峰,这可能会影响相变存储设备中数据读取过程的动力学和耐久性。讨论了该吸热峰的性质。结果表明,对合成的Ge_2Sb_2Te_5进行额外的退火处理可以提高材料的结构稳定性和热性能。

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