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High performance lithographic hotspot detection using hierarchically refined machine learning

机译:使用分层改进的机器学习进行高性能光刻热点检测

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Under real and continuously improving manufacturing conditions, lithography hotspot detection faces several key challenges. First, real hotspots become less but harder to fix at post-layout stages; second, false alarm rate must be kept low to avoid excessive and expensive post-processing hotspot removal; third, full chip physical verification and optimization require fast turn-around time. To address these issues, we propose a high performance lithographic hotspot detection flow with ultra-fast speed and high fidelity. It consists of a novel set of hotspot signature definitions and a hierarchically refined detection flow with powerful machine learning kernels, ANN (artificial neural network) and SVM (support vector machine). We have implemented our algorithm with industry-strength engine under real manufacturing conditions in 45nm process, and showed that it significantly outperforms previous state-of-the-art algorithms in hotspot detection false alarm rate (2.4X to 2300X reduction) and simulation run-time (5X to 237X reduction), meanwhile archiving similar or slightly better hotspot detection accuracies. Such high performance lithographic hotspot detection under real manufacturing conditions is especially suitable for guiding lithography friendly physical design.
机译:在真实且持续改善的制造条件下,光刻热点检测面临着几个关键挑战。首先,在布局后阶段,真正的热点变得越来越少,但是修复起来却更加困难。第二,必须将误报率保持在较低水平,以避免过多和昂贵地去除后处理热点。第三,全芯片物理验证和优化需要快速的周转时间。为了解决这些问题,我们提出了一种具有超快速度和高保真度的高性能光刻热点检测流程。它由一组新颖的热点签名定义以及具有强大的机器学习内核,ANN(人工神经网络)和SVM(支持向量机)的按层次划分的检测流程组成。我们已在实际制造条件下以45纳米制程在行业实力引擎上实现了我们的算法,并表明该算法在热点检测误报率(降低2.4倍至2300倍)和仿真运行方面显着优于以前的最新算法。时间(减少5倍至237倍),同时存档相似或稍好一些的热点检测精度。这种在实际制造条件下的高性能光刻热点检测尤其适合于指导光刻友好的物理设计。

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