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New Superimposed Pulsed Plasma Technology Using High Power Impulse Magnetron Sputtering (HiPIMS) Combined with DC or MF-Frequency

机译:结合高功率脉冲磁控溅射(HiPIMS)和直流或中频频率的新型叠加脉冲等离子体技术

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High Power Pulse Magnetron Sputtering (HPPMS), also known as High Power Impulse Magnetron Sputtering (HiPIMS) is a novel pulse plasma technology for coating applications. New developments in DC pulse power controllers allow very high peak power pulses. Combining DC power or medium frequency (MF) pulse power to HPPMS/HiPIMS processes offers significant advantages in the plasma and surface technologies. This technology is appropriate for single and dual magnetron applications and synchronized pulsed bias. It allows higher process rates for metallic and reactive sputtering applications. Processes, such as co-sputtering with different target materials using dual magnetron systems and asymmetric bipolar pulse modes are possible. Applicable HPPMS/HiPIMS pulse packages with superimposed DC or MF sputtering open new fields of applications.
机译:高功率脉冲磁控溅射(HPPMS),也称为高功率脉冲磁控溅射(HiPIMS)是一种用于涂层应用的新型脉冲等离子体技术。直流脉冲功率控制器的新发展允许很高的峰值功率脉冲。将直流电源或中频(MF)脉冲电源与HPPMS / HiPIMS工艺相结合,在等离子和表面技术中具有明显的优势。该技术适用于单磁控管和双磁控管应用以及同步脉冲偏置。对于金属和反应性溅射应用,它允许更高的处理速率。诸如使用双磁控管系统和不对称双极脉冲模式与不同目标材料共同溅射等工艺是可能的。适用的HPPMS / HiPIMS脉冲封装具有叠加的DC或MF溅射技术,开辟了新的应用领域。

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