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Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS)

机译:大功率脉冲磁控溅射(HIPIMS)中的电弧抑制和脉冲

摘要

An apparatus for generating sputtering of a target to produce a coating on a substrate is provided. The apparatus comprises a magnetron including a cathode and an anode. A power supply is operably connected to the magnetron and at least one capacitor is operably connected to the power supply. The apparatus also includes an inductance operably connected to the at least one capacitor. A first switch and a second switch are also provided. The first switch operably connects the power supply to the magnetron to charge the magnetron and the first switch is configured to charge the magnetron according to a first pulse. The second switch is operably connected to discharge the magnetron. The second switch is configured to discharge the magnetron according to a second pulse.
机译:提供了一种用于产生靶的溅射以在基板上产生涂层的设备。该设备包括磁控管,该磁控管包括阴极和阳极。电源可操作地连接到磁控管,并且至少一个电容器可操作地连接到电源。该设备还包括可操作地连接到至少一个电容器的电感。还提供了第一开关和第二开关。第一开关可操作地将电源连接到磁控管以对磁控管充电,并且第一开关配置为根据第一脉冲对磁控管充电。第二开关可操作地连接以使磁控管放电。第二开关配置成根据第二脉冲使磁控管放电。

著录项

  • 公开/公告号US9355824B2

    专利类型

  • 公开/公告日2016-05-31

    原文格式PDF

  • 申请/专利权人 STANISLAV KADLEC;JÜRGEN WEICHART;

    申请/专利号US20070954507

  • 发明设计人 STANISLAV KADLEC;JÜRGEN WEICHART;

    申请日2007-12-12

  • 分类号H01J37/34;H01J37/32;C23C14/35;C23C14/34;

  • 国家 US

  • 入库时间 2022-08-21 14:29:17

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