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Depth Profiling of Chemical Bonding States of Impurity Atoms and Their Correlation with Electrical Activity in Si Shallow Junctions

机译:硅浅结中杂质原子化学键合态的深度分布及其与电活动的关系

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Chemical bonding states of doped impurities such as B, As, P and Sb in Si were analyzed by soft X-ray photoelectron spectroscopy (SXPES). A step-by-step shallow etching and Hall effect measurements were combined with the SXPES to investigate correlation between chemical bonding state and electrical activation, and to clarify depth profiles of concentration of activated and deactivated impurities in shallow junctions. The study of B doped layer revealed that one chemical bonding state is assined to activated B and the other two states are correlated with deactivated B, which probably form B clusters. On the other hand, two different chemical bonding states were detected for each donor type impurity (As, P and Sb), however, these two states could not be necessarily correlated with the electrically activated and deactivated atoms.
机译:通过软X射线光电子能谱(SXPES)分析了Si中掺杂杂质如B,As,P和Sb的化学键态。将逐步浅蚀刻和霍尔效应测量与SXPES结合使用,以研究化学键合状态与电活化之间的相关性,并弄清浅结中活化和失活杂质的浓度深度曲线。对硼掺杂层的研究表明,一种化学键合状态与活化的硼有关,而另两种状态与失活的硼相关,很可能形成B团簇。另一方面,对于每个施主类型的杂质(As,P和Sb),检测到两个不同的化学键合状态,但是,这两个状态不一定与电激活和失活的原子相关。

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