首页> 外文会议>2010 International workshop on junction technology : Extended abstracts >Vacancy-Type Defects in Ultra-Shallow Junctions Fabricated Using Plasma Doping Studied by Positron Annihilation
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Vacancy-Type Defects in Ultra-Shallow Junctions Fabricated Using Plasma Doping Studied by Positron Annihilation

机译:正电子ni没研究等离子体掺杂制备的超浅结中的空位缺陷

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Vacancy-type defects in plasma immersion B-implanted Si were probed by a monoenergetic positron beam. A positron annihilates with an electron and emits two 511 keV γ-quanta. Doppler broadening spectra of the annihilation radiation were measured and compared with spectra calculated using the first-principles calculations. For the as-doped sample, the vacancy-rich region was found to be localized within 0-10 nm from the surface, and the major defect species were determined to be divacancy-B complexes. After spike rapid thermal annealing at 1075°C, those complexes were annealed out, and turned to B clusters such as icosahedral B12 distributed between 4 nm and 32 nm from the surface. We will demonstrate that that the positron annihilation technique is sensitive to point defects in shallow junctions formed on Si substrates without influence of B atoms located in the substitutional site.
机译:用单能正电子束探测等离子体浸没B注入的Si中的空位型缺陷。一个正电子会ni灭电子,并发射出两个511 keVγ量子。测量了radiation灭辐射的多普勒加宽光谱,并将其与使用第一原理计算的光谱进行了比较。对于掺杂样品,发现空位富集区域位于离表面0-10 nm的范围内,并且确定的主要缺陷种类是divacancy-B络合物。在1075°C进行快速快速热退火后,将这些复合物退火,然后转变为B簇,例如分布在距表面4 nm至32 nm之间的二十面体B12。我们将证明,正电子an灭技术对在Si衬底上形成的浅结中的点缺陷敏感,而不受位于取代位点的B原子的影响。

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