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The 3-dimensional vertical FG NAND flash memory cell arrays with the novel electrical S/D technique using the Extended Sidewall Control Gate (ESCG)

机译:具有新型电子S / D技术的3维垂直FG NAND闪存单元阵列,使用扩展侧壁控制门(ESCG)

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摘要

We propose the novel 3-dimensional (3-D) vertical floating gate (FG) NAND flash memory cell arrays with novel electrical source/drain (S/D) technique using Extended Sidewall Control Gate (ESCG). Cylindrical FG structure cell is implemented to overcome the reliability issues of the charge trap cell such as SONOS and TANOS cell. We also propose the novel electrical S/D layer using the ESCG structure to realize the enhancement mode operation. Using this novel structure, we successfully demonstrate the normal flash cell operation with high-speed programming and superior read current due to both the increasing of coupling ratio and low resistive electrical S/D technique. Moreover, we found that the 3-D vertical flash memory cell array with novel electrical S/D technique had less interference with neighboring cells by about 50% in comparison with planar FG NAND cell. From above all, the proposed cell array is one of the candidates of Terabit 3-D vertical NAND flash cell array with high-speed read/program operation and high reliability.
机译:我们提出了使用扩展侧壁控制门(ESCG)的新颖的3维(3D)垂直浮栅(FG)NAND闪存单元阵列,并采用了新颖的电源/漏极(S / D)技术。圆柱形FG结构单元被实现以克服诸如SONOS和TANOS单元之类的电荷陷阱单元的可靠性问题。我们还提出了使用ESCG结构的新型电气S / D层,以实现增强模式操作。使用这种新颖的结构,由于耦合比的增加和低电阻电S / D技术的成功应用,我们成功地演示了高速编程和出色读取电流的正常闪存单元操作。此外,我们发现,与平面FG NAND单元相比,采用新型电S / D技术的3-D垂直闪存单元阵列对相邻单元的干扰降低了约50%。总体而言,所提出的单元阵列是具有高速读取/编程操作和高可靠性的Terabit 3-D垂直NAND闪存单元阵列的候选之一。

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