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A conceptual methodology of “industrial engineering” for “the industry as a whole”: Semiconductor industry as illustration

机译:“整个行业”的“工业工程”概念方法论:以半导体行业为例

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The discipline of industrial engineering has been declining in many countries in light of the changes of industry structures in developed countries, in which the competition is no longer among individual companies while the collaboration among horizontally specialized value providers are critical for the success of the individual companies as well as the whole supply chain. There should be a systematic methodology of “industrial engineering” that focuses on “industry as a whole” as the subject of study to differentiate our discipline from others such as electrical engineering or chemical engineering. Focusing on semiconductor industry as the specific subject, this study aims to propose a conceptual methodology of industrial engineering to investigate semiconductor industry. In particular, semiconductor industry is one of the most complicated and capital-intensive industries. Driven by Moore''s Law, semiconductor industry has a clock speed faster than other industries and thus can provide an important benchmark for other industries. In the presentation, we propose a framework to explain the evolution of the semiconductor industry from the point of view of modularity and integration driven by technical and economical considerations to simplify complex production problems. Several case studies of the companies in different positions of the semiconductor value chain are illustrated to discuss some of the challenges and ongoing changes. TSMC established a pure wafer foundry business model in 1987 that assumes all the costs of capital expenditure and expenses in wafer fabrication never competes with its clients of fabless design houses and IDMs. The pure foundry can easily scale up or down its production capacity according to an individual customer''s needs, while maximizing fab utilization with a portfolio of various customers. Such a business model freed fabless and IDM designers from the burden of capital investment for advanced technolo--gy capacity. Thus, IC designers can concentrate on chip design for various applications including PC and consumer electronics. Meanwhile, the semiconductor industry is moving to more narrow specialization such as Ardentec that focuses on the middle layer of wafer sort between front-end of IC design and wafer fabrication and backend of IC packaging and final testing. Nevertheless, Global Unichip Corporation that positions itself as a design foundry focusing on SoC (System on a Chip) is trying to virtually integrate the supply chain to deal with technical challenges driven by Moore''s Law and technological inseparability involved in SoC and SiP (System in Package). This talk will conclude with discussions of the implications of semiconductor industry evolution to computers and industrial engineering research.
机译:鉴于发达国家产业结构的变化,许多国家的工业工程学科一直在下降,在这些国家中,不再是单个公司之间的竞争,而水平专业化价值提供者之间的合作对于单个公司的成功至关重要。以及整个供应链。应该有一个系统的“工业工程”方法论,其重点是“整个工业”作为研究主题,以区别我们的学科与电气工程或化学工程等其他学科。以半导体工业为主题,本研究旨在提出一种工业工程学的概念方法,以研究半导体工业。特别地,半导体工业是最复杂和资本密集的产业之一。在摩尔定律的推动下,半导体行业的时钟速度比其他行业要快,因此可以为其他行业提供重要的基准。在演示中,我们提出了一个框架,该框架从技术和经济考虑因素驱动的模块化和集成的角度来解释半导体行业的发展,以简化复杂的生产问题。举例说明了处于半导体价值链不同位置的公司的一些案例研究,以讨论一些挑战和持续变化。台积电于1987年建立了纯晶圆代工业务模型,该模型假定所有资本支出成本和晶圆制造支出永远不会与无晶圆厂设计公司和IDM的客户竞争。纯晶圆代工厂可以轻松地根据单个客户的需求扩大或缩小其生产能力,同时通过各种客户的组合来最大程度地提高晶圆利用率。这种商业模式使无晶圆厂和IDM设计师免于先进技术的资本投资负担。 -- gy能力。因此,IC设计人员可以专注于针对各种应用(包括PC和消费类电子产品)的芯片设计。同时,半导体行业正在转向更狭窄的专业领域,例如Ardentec,专注于IC设计和晶圆制造的前端,IC封装的后端和最终测试之间的晶圆分类中间层。尽管如此,将全球Unichip Corporation定位为专注于SoC(片上系统)的设计代工厂,正在尝试虚拟整合供应链,以应对摩尔定律和SoC与SiP所涉及的技术不可分割性所带来的技术挑战(封装中的系统)。演讲的最后将讨论半导体产业演进对计算机和工业工程研究的影响。

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