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STUDY ON ENERGY ABSORPTION PROPERTIES OF HIGH IMPACT EPOXY RESIN/HGB COMPOSITES ENCAPSULATING MATERIALS

机译:高冲击环氧树脂/ HGB复合材料封装材料的能量吸收性能研究

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High performance encapsulating materials for fuze are of vital importance in the process of hard target penetration. This paper studied the dynamic mechanical properties and the energy absorption properties of epoxy resins filled with hollow glass beads (HGB) as the main toughener. First, split Hopkinson pressure bar (SHPB) experiment under different temperature was conducted to obtain the dynamic mechanical properties characterization. Then, the SHPB experiments was modified with short projectile and long specimen with confining pressure to examine the stress attenuation and energy attenuation properties. The stress-strain curve under different temperature was compared and we obtained that the ratio of the peak value of transmitted wave to that of incident wave is about 034-0.38, with the corresponding energy ratio about 0.17-0.19. The results showed that the HGB epoxy resin composites is promising potting materials for electronic-packaging survivability of penetration fuze systems.
机译:在硬目标渗透过程中,引信材料的高性能封装材料至关重要。本文研究了填充空心玻璃珠(HGB)作为主要增韧剂的环氧树脂的动态力学性能和能量吸收性能。首先,进行不同温度下的分裂霍普金森压力棒(SHPB)实验以获得动态机械性能。然后,通过短射弹和长标本改性SHPB实验,具有限制压力,以检查应力衰减和能量衰减性能。比较了不同温度下的应力 - 应变曲线,并获得了透射波的峰值与入射波的比率为约034-0.38,相应的能量比为约0.17-0.19。结果表明,HGB环氧树脂复合材料是渗透引信系统的电子包装活力的承诺灌封材料。

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