Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet

摘要

An epoxy resin composition comprising (a) an epoxy resin, (b) a curing agent, (c) a cure accelerator and (d) silica powder. The silica powder (d) is composed of (d1) a first silica powder having a particle diameter ranging from 5 to 75 &mgr;m, (d2) a second silica powder having a particle diameter ranging from 0.2 to 0.9 &mgr;m, and (d3) a third silica powder having a particle diameter ranging from 0.01 to 0.08 &mgr;m.