首页> 外文会议>Quality Electronic Design (ISQED), 2010 >Structural fault collapsing by superposition of BDDs for test generation in digital circuits
【24h】

Structural fault collapsing by superposition of BDDs for test generation in digital circuits

机译:通过叠加BDD进行结构故障折叠以在数字电路中生成测试

获取原文

摘要

The paper presents a new structural fault-independent fault collapsing method based on the topology analysis of the circuit, which has linear complexity. The minimal necessary set of faults as the target objective for test generation is found. The main idea is to produce fault collapsing concurrently with the construction of structurally synthesized binary decision diagrams (SSBDD) used for test generation, as a side effect. To improve the fault collapsing, a new class of BDDs in a form of SSBDDs with multiple inputs (SSMIBDD) is proposed, which allows a significant reduction of the model complexity for test generation purposes, and produces collapsed fault sets with less sizes than the SSBDDs provide. Experimental data show that the fault collapsing by the proposed method is considerably more efficient than other structural fault collapsing methods with comparative time cost. The method is especially efficient for circuits with high rate of internal fanouts.
机译:基于电路的拓扑分析,提出了一种新的结构独立的与故障无关的故障倒塌方法,该方法具有线性复杂度。找到了作为测试生成目标目标的最低限度的故障集。其主要思想是在产生故障时崩溃,同时还会生成用于测试生成的结构综合二进制决策图(SSBDD),这是一个副作用。为了改善故障崩溃,提出了一种具有多个输入的SSBDD形式的新BDD(SSMIBDD),它可以显着降低模型复杂性以进行测试生成,并生成尺寸比SSBDD小的折叠故障集。提供。实验数据表明,与其他结构性故障倒塌方法相比,所提方法的故障倒塌效率要高得多,并且具有相对可观的时间成本。该方法对于内部扇出率高的电路特别有效。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号