'3D Wafer Bonding with a Silicon Germanium HBT BiCMOS Wafer for Compact Fast Light Modulator for Photonic Interconnect'

摘要

Sitting under the SiGe HBT is an unrecognized but pre-existing resource, free carriers, which could be used to perform light modulation. 3D technology can be used to bond waveguides, photonic crystals, and Ge detectors under the HBT.