NXP System-in-Package vision and latest 3D technologydevelopments

摘要

Today, the System-in-Package approach offers a new dimension to system integration, far beyond meredense micro-packaging of existing SoC solutions. Not only does SiP offer the capability to integrate almost anykind of companion passive component with a given active circuit, but it also enables flexible combinations ofanalogue circuits, RF functions or even micro-electro-mechanical (MEMS) components with digital integratedcircuits. SiP widens the degree of integration and allows ultimate miniaturization as it introduces the thirddimension to microelectronics. To any given SoC technology node, SiP brings yet another step in systemintegration for a wide range of applications.Due to its modular and flexible approach and its multi-technology nature, SiP poses a serious question ofchoice when it comes to defining future technologies. Too many different technology developments will lead toan overall weakening in terms of "breakthrough" innovation.The first part of the presentation will emphasize on NXP's SiP vision, both in terms of technology andexpected application benefits. Then the SiP-specific technology challenges will be listed. Several examples ofNXP’s on-going 3D vertical integration innovation projects will be given through the presentation to showcasethe many aspects to consider in a new SiP technology platform development, from packaging to passiveintegration, from test to Computer-Aided-Design and virtual prototyping, how they relate to one another, andhow the apparent wide diversity of constituent technology building blocks can lead to a coherent integralroadmap with limited complementary "SiP platforms".