首页>外文会议>The 16th European Microelectronics and Packaging Conference & Exhibition pt.1

The 16th European Microelectronics and Packaging Conference & Exhibition pt.1

The 16th European Microelectronics and Packaging Conference & Exhibition pt.1

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1.NXP System-in-Package vision and latest 3D technologydevelopments

机译：恩智浦系统级封装愿景和最新3D技术开发
- 作者：J.-M. Yannou;F. Neuilly;J.-O. Moreno;M. Pommier;S. Bellenger;P. Biermans
- 会议名称：《The 16th European Microelectronics and Packaging Conference Exhibition pt.1》 | 2007年
- 3D vertical integration;
- SiP;
- Through silicon vias;
- passive integration;
- Wafer-level Packaging;
2.NXP System-in-Package vision and latest 3D technologydevelopments

机译：恩智浦系统级封装愿景和最新3D技术开发
- 作者：J.-M. Yannou;F. Neuilly;J.-O. Moreno;M. Pommier;S. Bellenger;P. Biermans
- 会议名称：《The 16th European Microelectronics and Packaging Conference Exhibition pt.1》 | 2007年
- 3D vertical integration;
- SiP;
- Through silicon vias;
- passive integration;
- Wafer-level Packaging;

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