PressFIT technology offers the possibility of solderless mounting of power modules, meeting the demands of lead free technology and increases the assembly efficiency and reliability. No special surface plating PCB boards are needed. Environmental tests show that vibration loads and climate sequences have nonegative influence on the contact resistance. This results from the gas-tight contact and high contact force.The high holding forces of the contact are independent of the PCB-hole tolerances. This reduces the effort for mechanical fixing similar to solder connections. The PressFIT process can be separated from soldering and allows module mounting on soldering and component side of PCB. The high reliability of PressFIT contacts in general promise to increase the system reliability and mount efficiency. This is especially of interest, if modules are operated in harsh environment.
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