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A 3D Analytical Model for Calculating the On-resistance of Integrated VDMOSFET

机译:用于计算集成VDMOSFET导通电阻的3D分析模型

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Power Integrated Circuits (PlCs) combine high voltage and/or high current devices monolithically with low voltage control circuits. Since all the contacts of the integrated VDMOSFET are on the top of chip, the calculation of its on-resistance doesnit scale in the same manner as for conventional VDMOSFET. The on-resistance of an integrated VDMOSFET is affected deeply by the placement and number of source ceils. In this paper, a 3D analytical model for calculating the on-resistance of integrated VDMOSFET accurately is developed, and can predict the optimum of placement and number of cells for a minimal specific on-resistance within limited chip area.
机译:功率集成电路(PlC)将高压和/或高电流设备与低压控制电路整体地结合在一起。由于集成VDMOSFET的所有触点都在芯片顶部,因此其导通电阻的计算不会像传统VDMOSFET那样按比例缩放。集成VDMOSFET的导通电阻会受到源极引线的位置和数量的严重影响。在本文中,开发了一种用于精确计算集成VDMOSFET导通电阻的3D分析模型,该模型可以在有限的芯片面积内以最小的特定导通电阻预测最佳的单元位置和单元数。

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