首页> 外文会议>Seventeenth European Photovoltaic Solar Energy Conference >ELECTRICAL AND THERMAL PROPERTIES OF THE METASTABLE DEFECT IN BORON-DOPED CZOCHRALSKI SILICON (CZ-SI)
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ELECTRICAL AND THERMAL PROPERTIES OF THE METASTABLE DEFECT IN BORON-DOPED CZOCHRALSKI SILICON (CZ-SI)

机译:掺硼的直晶硅(CZ-SI)的亚稳缺陷的电学和热学性质

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Lifetime degradation observed in boron-doped Czochralski silicon (Cz-Si) has its origin in a metastable defect that is activated under illumination or forward bias and deactivated under an anneal at around 200°C. To give insight into the physical mechanism underlying this defect transformation, the first part of this study is focused on the kinetics of defect formation and annihilation. For the process of defect formation, the quantitative analysis of this work clearly shows that it cannot be directly described by the mechanism of recombination-enhanced defect reaction (REDR) as it has been proposed in recent studies. While REDR predicts for the defect generation rate U_(gen) a linear dependence on the doping concentration N_A and the injection level Δn, a quadratic doping and a vanishing injection dependence is found by an improved time-resolved degradation experiment measured with quasi-steady-state photoconductance technique. The experiment reveals that U_(gen) reaches almost its maximum value if Δn only lies above some threshold value, which is already reached for an illumination with 1 mW/cm~2 on a 0.86 Ωcm Cz-sample. For the process of defect annihilation, an isothermal annealing experiment reveals that it is thermally activated with an energy barrier E_(barr) = 1.32 +- 0.05 eV, determined for the first time. The last part of the study is dedicated to the electronic structure of the defect. From temperature-dependent lifetime spectroscopy (TDLS) an upper limit of 0.41 eV is found for the energy level of the Cz-defect in its active state. If the TDLS-result of this work is combined with the energy range determined by Schmidt et al. from injection dependent lifetime spectroscopy, the energy level of the defect in its active state can be further localized in the lower band half at E_V + 0.35 ... 0.41 eV.
机译:在掺硼的切克劳斯基硅(Cz-Si)中观察到的寿命退化的起源是亚稳缺陷,该缺陷在光照或正向偏压下被激活,在约200°C的退火条件下被失活。为了深入了解这种缺陷转变的物理机制,本研究的第一部分集中于缺陷形成和an灭的动力学。对于缺陷形成的过程,这项工作的定量分析清楚地表明,不能像最近研究中提出的那样,通过重组增强缺陷反应(REDR)的机制直接描述它。尽管REDR预测缺陷产生率U_(gen)与掺杂浓度N_A和注入水平Δn呈线性相关性,但通过改进的时间分辨降解实验(通过准稳态测量)可以发现二次掺杂和消失的注入相关性状态光电导技术。实验表明,如果Δn仅在某个阈值之上,则U_(gen)几乎达到最大值,这对于在0.86ΩcmCz样本上以1 mW / cm〜2的照明已经达到。对于缺陷an灭的过程,等温退火实验表明,它是通过首次确定的能垒E_(barr)= 1.32 +-0.05 eV进行热活化的。研究的最后一部分致力于缺陷的电子结构。根据温度相关的寿命光谱(TDLS),发现处于活动状态的Cz缺陷的能级上限为0.41 eV。如果将这项工作的TDLS结果与Schmidt等人确定的能量范围相结合,则可以得出结论。根据注入相关的寿命谱,可以将处于活动状态的缺陷的能级进一步定位在E_V + 0.35 ... 0.41 eV的下半带。

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