Plasma Etching of Quartz for the Fabrication of Alternating Aperture Phase Shift Photomasks: Etch Rate Uniformity Study Utilizing a Next Generation ICP Source

摘要

As on-glass line widths shrink and exposure wavelengths approach the physical limitations of optical lithographic printing, the adoption of newer technology such as Off-Axis Illumination and Phase Shift Photomask technologies will substantially expand the operating life of DUV lithographic tools.