The PSGA, a Lead-Free CSP for High Performance High Reliable Packaging

摘要

The Polymer Stud Grid Array (PSGATM) is an innovative package and enters the market to fulfil the demands of the ongoing miniaturisation combined with cost reduction. This paper describes the processing of the PSGA substrate and the benefits of the PSGA for chip packaging. A full description of the qualification results for this new package technology is given. This qualification includes the determination of the thermal behaviour, the high frequency electrical characterisation and the first and second level reliability results. Both experimental testing as well as the use of simulation techniques result in an optimal design for this PSGA.