Reliability study of new SnZnAl lead-free solders used in CSP packages

摘要

We have implemented a company-wide effort to progressively reduce the use of Pb(lead) and eventually eliminate this environmental pollutant from its products. As part of this effort, it has developed a new lead-free solder that consisting of Sn(tin), Zn(zinc), and Al(aluminum) and yet offers superior productivity and joint reliability. The new lead-free solder has a melting point equivalent to that of a SnPb eutectic solder, and enables devices to be packaged at a lower temperature than with the increasingly popular Sn(tin), Ag(silver), Cu(copper) solder. Thus, the new lead-free solder accelerates the elimination of Pb from products, we have already used printed circuit boards containing the new lead-free solder in some products, and plans to extend its use to other products. We further mounted SnZnAl solder balls onto Cu/Ni(nickel)/Au(gold) plated polyimide substrate at a joining temperature of 215℃ for CSP applications. It was confirmed that the joint interface between soldered ball and substrate at the initial stage was made of 2-layered compounds, i.e., AuZnSn on soldered side and ZnSnNi on substrate side. After 1000h aging at 150℃, the two layers compounds become one layer of ZnSnNiAu compound. No strength deterioration of Cu/Ni/Au/SnZnAl after the 1300h shelf test was detected in the ball shear strength compared with the initial value. This paper describes the characteristics of the new lead-free solder and the results of a study on its solder ball CSP package.