X-RAY INSPECTION EXPLORING 3D TECHNOLOGIES FOR TODAY'S APPLICATIONS

摘要

For years industry has used traditional, two dimensional, transmission X-Ray as a means of exploring hidden structures such as BGA Solder Joints. Three-dimensional techniques such as Laminography and Tomosynthesis allow viewing of slices, or cross sections, within a 3D structure so as to eliminate confusion caused by double sided boards. Computed Tomography provides a more useful, true three-dimensional view of the entire sample including vertical location and extent of defects within a solid structure. This paper will look at the latest CT technology and present some practical applications.