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Design of experiments for lead free materials, surface finishes and manufacturing processes of printed wiring boards

机译：导铅材料，表面饰面和印刷线路制造工艺的实验设计

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摘要

As the European and global marketplaces consider mandating lead-free electronic equipment, many questions arise about the technical feasibility of replacing lead in Printed Wiring Board (PWB) soldering applications.

机译：由于欧洲和全球市场考虑了授权无铅电子设备，因此在印刷线路板（PWB）焊接应用中更换引线的技术可行性出现了许多问题。

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来源
《SMTA international conference》|2000年||共11页
会议地点
作者
Dr.Sammy Shian; Karen Walters; Tom Bresnan; Peter Biocca; Tim Skidmore; David Pinsky; Phil Provencal; Don Abbott;
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原文格式 PDF
正文语种
中图分类半导体技术;
关键词
leadfree; design of experiments; PWB soldering;

机译：无铅;实验设计;PCB焊接;

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专利

1. Substrate-induced coagulation of carbon black on gelatine-modified printed wiring board surfaces Part 1. Gelatine adsorption on to printed wiring board surfaces [J] . Bele M., Besenhard JO., Ribitsch V., Colloids and Surfaces, A. Physicochemical and Engineering Aspects . 1998,第1期

机译：基质诱导的明胶改性印刷电路板表面上炭黑的凝结第1部分。明胶吸附到印刷电路板表面上
2. Study of Immersion Silver and Tin Printed-Circuit-Board Surface Finishes in Lead-Free Solder Applications [J] . Minna Arra, DongkaiShangguan, Dongji Xie, Journal of Electronic Materials . 2004,第9期

机译：无铅焊料应用中浸银和锡印刷电路板表面处理的研究
3. Proposal of Very High Performance and High Density Printed Wiring Board and Its Very High Productivity Manufacturing Processes [J] . Ohmi T., Goto T., Imai H., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011,第4期

机译：高性能，高密度印刷线路板及其高生产率制造工艺的建议
4. Design of experiments for lead free materials, surface finishes and manufacturing processes of printed wiring boards [C] . Dr.Sammy Shian, Karen Walters, Tom Bresnan, SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000 . 2000

机译：设计无铅材料，印刷线路板的表面光洁度和制造工艺的实验
5. Electronics assembly, rework, and reliability evaluation using lead-free soldering materials, halogen-free laminate materials, and surface finishes with nanomaterials. [D] . Morose, Gregory J. 2008

机译：使用无铅焊接材料，无卤素层压板材料以及纳米材料的表面光洁度进行电子组装，返工和可靠性评估。
6. 3D Printed Functional and Biological Materials on Moving Freeform Surfaces [O] . Zhijie Zhu, Shuang-Zhuang Guo, Xiaoxiao Fan, -1

机译：在移动的自由曲面上进行3D打印的功能和生物材料
7. Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Manufacturing Process of Printed Wiring Boards. [O] . Hiroharu KAMIYAMA 1993

机译：特殊问题/最近印刷布线板表面整理的趋势和未来评论。印刷配线板的制造工艺。
8. Implementing Cleaner Printed Wiring Board Technologies: Surface Finishes. Design for the Environment Printed Wiring Board Project. [R] . 2000

机译：实施更清洁的印刷线路板技术：表面处理。环境印刷线路板项目设计。

Design of experiments for lead free materials, surface finishes and manufacturing processes of printed wiring boards

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