Evaluation of 64 Pin Micro Star Bga~TM Package

摘要

With the migration from peripheral leads to solder balls, area array interconnect has answered new challenges in advanced chip technology. However, recent applications with smaller and lighter devices put forth more aggressive demands from a packaging perspective. The evolution of chip scale packages (CSP) addressed fine pitch as well as body size requirements. A large number of manufacturers have offered their own version of CSP realizing the tremendous growth opportunities in the portable consumer market. In addition to cost, reliability remains a key issue that producers have to tackle before a large enough market will prevail for CSP. Texas Instruments' near chip scale package, Micro Star BGA~TM, has proven to be a viable solution for current portable communication products. In this paper, the 64 pin Micro Star BGA~TM will be discussed in detail. The package under study has 0.8 mm pitch, with 8 x 8 mm body size and a solder ball diameter of 0.5 mm. Detailed package qualification results will be presented. Board level simulation data, thermal, and electrical modeling results will also be discussed.