A Systems Approach to Specifying a High eliability, High Quality Thick FilmPassive Component for Hybrid, Multi-Chip Module and Surface MountApplications

摘要

A quantitative analysis of thick film chip resistors is presented regarding design and construction. Critical reliability and performance data are compared for two techniques used to adjust final resistance tolerance —abrasive trimming and laser trimming. Additional enhanced performance characteristics are discussed for diamond sawing versus laser scribing methods of die separation, and 3-sided versus 5-sided surface mount terminations, including nickel barrier and solderability aspects. This analysis will provide vital information for component engineers working with parts specifications for thick film passive components. Additionally, specification guidelines are defined based upon each given packaging and electrical application for optimum performance and reliability of a thick film passive component. These guidelines are specified for applications involving epoxy die attach, eutectic die attach, wire bonding, and surface mount reflow soldering. Some typical pitfalls that occur when using an incorrectly specified component for a given application are discussed.