A STUDY OF THIN METAL FILM FORMATION ON LTCC SUBSTRATE

摘要

The convention method of surface electrode formation is that the electrode paste such as Ag, Cu is used to maintain surface electrode on LTCC substrate by screen printer, which is connected through inner via electrically. The above patterns of electrode have serious effects such as the thickness non uniformity, unclearance of line and space and bad brightness. It is very difficult for these patterns to perform fine surface patterns for electrode pad. Therefore, this study has investigated thin film formation by sputter method instead of screen printing method. The used metal electrodes are Ti, Cu. We have analyzed bonding strength interlace between LTCC and surface electrodes and have evaluated the structural morphology. The results confirm that adhesion strength is further improved by thick seed layer and electroform plating, as thickness of Ti seed layer increase in particular.