Novel cathodic arc plasma PVD system with column target for the deposition of TiN film and other metallic films

摘要

A novel cathodic arc plasma physical vapor deposition (PVD) process with column target for the deposition of metals and alloys has been developed. Low voltage and high current power is applied between the column target and anode. With the special designed magnetic field, the arc spots run circularly on the surface on the column target and move up and down with the movement of the magnetic field. The erosion on the target is well distributed. The discharge process is very stable and the working conditions are very wide. The working gas can be argon, nitrogen, oxygen, or any other gases according to the need of the chemical reactive deposition.