CRITICAL ISSUES WITH CHIP SCALE PACKAGES (CSPs)

摘要

CSPs will mainly be targeted for the lower leadcount, form factor constrained applications for the first generation of products. The migration to higher leadcount applications will only happen after the thermal issues, routing costs and complexities, and testing issues are resolved. The introduction of lower leadcount ICs in a CSP is advantageous to the industry as a whole because it will push the development of the technology and infrastructure to support this package option. The more complex, higher leadcount packages will follow in the footsteps of the lower end packages once the issues are resolved. In the meantime, higher complexity parts will stay on safer ground, with already established BGA or QFP type packages that can handle the thermal electrical, and routing issues.