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Transient simulations of three-dimensional integrated circuit interconnect using a mixed surface-volume approach

机译：使用混合表面体积方法的三维集成电路互连的瞬态仿真

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《ACM/IEEE conference on Design automation》|1995年|P.485-490|共6页
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Mike Chou; Tom Korsmeyer; Jacob White;
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中图分类计算技术、计算机技术;
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4. Transient Simulations of Three-dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume approach [C] . Mike Chou Tom Korsmeyer Jacob White Design Automation, 1995. DAC '95. 32nd Conference on . -1

机译：混合表面体积方法对三维集成电路互连的瞬态仿真
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7. Transient Simulations of Three-dimensional Integrated Circuit Interconnect using a Mixed Surface-Volume approach [O] . Mike Chou, Tom Korsmeyer, Jacob White 1995

机译：混合表面体积方法对三维集成电路互连的瞬态仿真

Transient simulations of three-dimensional integrated circuit interconnect using a mixed surface-volume approach

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