首页> 外文会议>Design Automation, 1995. DAC '95. 32nd Conference on >Transient Simulations of Three-dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume approach
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Transient Simulations of Three-dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume approach

机译:混合表面体积方法对三维集成电路互连的瞬态仿真

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It has recently been shown that the boundary-element method can be used to perform accurate cross-talk simulations of three-dimensional integrated circuit interconnect. However, the computational complexity grows as N2, where N is the number of surface unknowns. Straightforward application of the fast-multipole algorithm reduces the computational complexity to order N, but produces magnified errors due to the ill-conditioning of the steady-state problem. We present a mixed surface-volume approach and prove that the formulation results in the exact steady-state solution, independent of the multipole approximations. Numerical experiments are presented to demonstrate the accuracy and efficiency of this technique. On a realistic example, the new method runs fifteen times faster than using dense-matrix iterative methods.
机译:最近已经表明,边界元方法可以用于执行三维集成电路互连的精确串扰仿真。但是,计算复杂度随着N2的增长而增加,其中N是表面未知数的数量。快速多极点算法的直接应用将计算复杂度降低到N阶,但是由于稳态问题的病态而产生放大的误差。我们提出了一种混合的表面体积方法,并证明了该公式可得出精确的稳态解,而与多极近似无关。数值实验表明了该技术的准确性和效率。在一个实际的例子中,新方法的运行速度比使用密集矩阵迭代方法快十五倍。

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