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Transient Simulations of Three-dimensional Integrated Circuit Interconnect using a Mixed Surface-Volume approach

机译：混合表面体积方法对三维集成电路互连的瞬态仿真

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Mike Chou; Tom Korsmeyer; Jacob White;
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年度 1995
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1. A Generalized Surface-Volume Integral-Equation (SVIE) Approach for Analysis of Hybrid Planar/NRD-Guide Integrated Circuits [J] . Duochuan Li, Ke Wu IEEE Transactions on Microwave Theory and Techniques . 2005,第9期

机译：用于混合平面/ NRD指导集成电路分析的广义表面体积积分方程（SVIE）方法
2. Thermally-Aware Modeling and Performance Analysis of Mixed-MWCNTB as Very Large Scale Integrated Interconnects Material for Nano-Electronic Integrated Circuits Design [J] . Jindal Pardeep Kumar, Sandha Karmjit Singh Journal of Nanoelectronics and Optoelectronics . 2019,第9期

机译：混合MWCNTB的热敏意识式建模与性能分析为纳米电子集成电路设计的大规模集成互连材料
3. Algorithms for transient three-dimensional mixed-level circuit and device simulation [J] . Mayaram K., Jue-Hsien Chern IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems . 1993,第11期

机译：瞬态三维混合电平电路的算法和器件仿真
4. Transient simulations of three-dimensional integrated circuit interconnect using a mixed surface-volume approach [C] . Mike Chou, Tom Korsmeyer, Jacob White ACM/IEEE conference on Design automation . 1995

机译：使用混合表面体积方法的三维集成电路互连的瞬态仿真
5. Thermo-mechanical reliability of micro-interconnects in three-dimensional integrated circuits: Modeling and simulation. [D] . Rodriguez, Omar. 2010

机译：三维集成电路中微互连的热机械可靠性：建模和仿真。
6. Sequential Simulation (SqS): an innovative approach to educating GP receptionists about integrated care via a patient journey – a mixed methods approach [O] . Sharon-Marie Weldon, Shvaita Ralhan, Elisabeth Paice, 2015

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7. Transient Simulations of Three-dimensional Integrated Circuit Interconnect using a Mixed Surface-Volume approach [O] . Mike Chou, Tom Korsmeyer, Jacob White 1995

机译：混合表面体积方法对三维集成电路互连的瞬态仿真

Transient Simulations of Three-dimensional Integrated Circuit Interconnect using a Mixed Surface-Volume approach

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