首页> 外文会议>Solid State Device Research Conference, 1993. ESSDERC '93 >Comparative study of hot-carrier degradation in p+ and n+ poly p-MOSFET's of a 0.5 ¿m CMOS technology
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Comparative study of hot-carrier degradation in p+ and n+ poly p-MOSFET's of a 0.5 ¿m CMOS technology

机译:0.5μmCMOS工艺的p + 和n + 多晶硅p-MOSFET热载流子降解的比较研究

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摘要

In this paper, the degradation of p+ and n+ poly p-MOSFET devices of a 0.5 ¿m technology is studied in detail. The former devices exhibit intrinsically a better hotcarrier hardness. The difference in hot carrier behaviour between the p+ and n+ poly transistors is attributed mainly to the short channel effect. The p+ poly devices are therefore more suited for the realisation of deep submicron devices.
机译:在本文中,详细研究了0.5μm技术的p + 和n + 多晶硅p-MOSFET器件的退化。前一种器件本质上表现出更好的热载体硬度。 p + 和n + 多晶硅晶体管之间的热载流子特性差异主要归因于短沟道效应。因此,p + 多晶硅器件更适合于深亚微米器件的实现。

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