Due to their high hardness and brittleness, many single crystal and polycrystalline materials used in Micro Electro-mechanical Systems (MEMS) are very difficult to machine. Techniques like dicing and profiling are important fabrication steps used for MEMS or optical elements.The reliability and functionality of such systems are strongly dependant on the machining quality. Two materials of substantial interest are sapphire and Aluminia-Titanium Carbide (Altic). This paper discusses which machining parameters result in an optimal cutting quality.
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