LOW-COST AND HIGH PERFORMANCE SILICON INTERPOSERS AND PACKAGES (LSIP) - A NEW GEORGIA TECH PRC INDUSTRY CONSORTIUM

摘要

The Low-Cost Silicon Interposer (LSIP) industry consortium at Georgia Tech is proposed to address limitations of current organic packages as well as wafer-based silicon interposers that are being produced in wafer fabs. Organic substrates are seen as approaching limits in wiring, I/Os, warpage and acceptable cost. Silicon Interposers, on the other hand, suffer from high cost and low electrical performance. This paper addresses both these limitations.