STRUCTURAL FINITE ELEMENTAL MODELING OF A MULTILAYERED PLATED THROUGH-HOLE - EFFECT OF MATERIAL PROPERTIES

摘要

Plated Through-Hole (PTH) interconnects are subjected to thermal excursions during the component assembly process and during subsequent field operation. The build-up of materials with different expansion coefficients in a PTH structure is subjected to thermal stresses/strains during these excursions. These stresses are a significant driving force for PTH interconnect failure. Determination of these stresses is a complex task and has been addressed utilizing several different techniques. In this research, a Finite Element Modeling (FEM) approach using ANSYS simulation software was utilized to study the effect of different PTH build-up material characteristics on the various stresses and displacements within a PTH structure in a 22-layered printed circuit board. The effect of the moduli and coefficients of thermal expansion of the holefill material, the prepreg resin, and the plated copper, on the vertical sidewall stresses within the PTH and the maximum displacement within the PTH was investigated.