Effect of Al_2O_3 and SiO_2 Abrasives on the CMP of Molybdenum using Different Polishing Parameters

摘要

In this work the behavior of Molybdenum (Mo) during chemical mechanical polishing (CMP) is examined. The material removal rates (MRR) were studied by changing not only the chemical (abrasive and oxidizer concentration, pH) but also the mechanical (downforce pressure, platen and carrier speed and polishing pad) parameters.