flip-chip devices; chip scale packaging; anisotropic media; adhesives; silicon compounds; wide band gap semiconductors; differential scanning calorimetry; integrated circuit reliability; thermal management (packaging); heat transfer; anisotropic conductive adhesives; flip chip packaging; thermal conductivity enhancement; ACA fillers; thermomechanical analysis; dynamic scanning calorimetry; DSC; dynamic mechanical analysis; DMA; TMA; current carrying capability; flip chip joint reliability; thermal transfer medium; flip chip assembly; high current stressing; SiC;
机译:倒装芯片应用中具有增强导热性的各向异性导电胶
机译:各向异性导电胶和非导电胶在智能纺织应用中生产的倒装芯片接头的接触电阻比较
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机译:在有机基材应用上使用新的各向异性导电粘合剂进行显着的Reliublity增强
机译:磁对准Z轴各向异性导电胶及其应用。
机译:走向纸基印刷电路的实际应用:毛细作用可有效增强热塑性导电胶的导电性
机译:具有各向异性导电粘合剂和智能纺织应用的各向异性导电粘合剂和非导电粘合剂生产的倒装芯片接头的接触电阻比较