ANISOTROPIC CONDUCTIVE ADHESIVE FILM, ITS MANUFACTURE, FLIP-CHIP MOUNTING METHOD, AND FLIP-CHIP PACKAGING BOARD

摘要

PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive film where the connection and operation of a flip-chip single substance can be inspected in tentatively connected state and that can be repaired on the spot when the connection and operation are found to be faulty on inspection. ;SOLUTION: An anisotropic conductive adhesive film 8 includes a conductive particle on a film that consists of a thermosetting adhesive 7. In this case, the conductive particle is an elastic conductive particle 9, the diameter of the elastic conductive particle 9 is slightly larger than the thickness of the film of the thermosetting adhesive 7, the surface of the elastic conductive particle 9 exposed from the surface of the film, and the position in a plane direction of the film of the thermosetting adhesive 7 of the elastic conductive particle 9 is located at a position where the elastic conductive particle 9 touches the electrode 2 of a flip-chip 1. The elastic conductive particle 9 of the anisotropic conductive adhesive film 8 is pinched between an electrode 5 of a substrate 4 and the electrode 2 of the flip-chip 1, and the electrode 5 of the substrate 4 and the electrode 2 of the flip-chip 1 are connected and adhered.;COPYRIGHT: (C)1999,JPO