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A thick photoresist process for open-channel sensing packaging applications by JSR THB-151N negative UV photoresist

机译：JSR THB-151N负性UV光刻胶用于开路传感封装应用的厚光刻胶工艺

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《》||P.288-291|共4页
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Chung-Yi Hsu; Lung-Tai Chen; Jin-Sheng Chang; Chun-Hsun Chu;
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中图分类工业技术;
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1. A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist [J] . Rao VS, Kripesh V, Yoon SW, Journal of Micromechanics and Microengineering . 2006,第9期

机译：使用JSR THB-151N负性UV光刻胶的先进晶圆级封装应用的厚光刻胶工艺
2. Angle effect of ultrasonic agitation on the development of thick JSR THB-430n negative UV photoresist [J] . F. -G. Tseng, C. -S. Yu Microsystem technologies . 2002,第6期

机译：超声搅拌对厚JSR THB-430n负性UV光刻胶显影的角度影响
3. High aspect ratio ultrathick micro-stencil by JSR THB-430N negative UV photoresist [J] . Tseng FG., Yu CS. Sensors and Actuators, A. Physical . 2002,第0期

机译：JSR THB-430N负性紫外线光刻胶的高深宽比超厚微模板
4. A thick photoresist process for open-channel sensing packaging applications by JSR THB-151N negative UV photoresist [C] . Chung-Yi Hsu, Lung-Tai Chen, Jin-Sheng Chang, International Microsystems, Packaging, Assembly and Circuits Technology . 2007

机译：JSR THB-151N负紫外光致抗蚀剂的开放式传感包装应用的厚光致抗蚀剂工艺
5. Precision excimer laser lithography for cylindrical substrates with thick photoresists. [D] . Cole, Robert L. 2004

机译：精密准分子激光光刻技术，用于带有厚光刻胶的圆柱形基板。
6. Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists [O] . Lung-Tai Chen, Jin-Sheng Chang, Chung-Yi Hsu, 2009

机译：基于图案化超厚光刻胶的基于MEMS的压力传感器封装的制造和性能
7. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS [O] . Lorenz, Hubert, Despont, M., Fahrni, N., 1998

机译：高纵横比，超厚，负性近紫外光刻胶及其在MEMS中的应用
8. Optimization of Thick Negative Photoresist for Fabrication of Interdigitated Capacitor Structures. [R] . Enriquez, E., Shreiber, D., Ngo, E., 2015

机译：用于交叉电容器结构制作的厚负光刻胶的优化。

A thick photoresist process for open-channel sensing packaging applications by JSR THB-151N negative UV photoresist

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