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Epilayer Thickness and Doping Density Variation Effects on Current-Voltage (I-V) Characteristics of n-GaN Schottky Diode

机译:外延层厚度和掺杂浓度变化对n-GaN肖特基二极管电流-电压(I-V)特性的影响

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The epilayer thickness and doping density variation effects on the (I-V) characteristics of n-GaN schottky diode are determined numerically. In this work the epilayer thickness of n-GaN schottky diode are varied from 3驴m 11驴m while doping density are varied from 1脳10 12cm-3 1脳10 17cm-3. The simulation work is conducted using Atlas/Blaze developed by Silvaco. The various models such as Srh (Shockley- Read Hall), Cvt (Lombardi model), Auger, Impact (Grants model), Bgn (Band gap narrowing), Conmob (concentration dependent mobility) is used to get optimum (I-V) characteristics of n-GaN schottky diode. We find that in forward biased as the epilayer thickness varied from 3驴m 11驴m at constant doping density 1脳10 12cm-3 the forward current decreases due to the increase in series resistance, on the other hand the forward current increased by lowering the epilayer thickness up to 3驴m and increasing the doping density 1脳10 17cm-3. In reverse biased the selection of doping density and epilayer thickness directly determined the target reverse breakdown voltage of the device. As the epilayer thickness varied from 3驴m 11驴m at constant doping density 1脳10 12cm-3, the breakdown voltage increased due to increased in the depletion width, while the breakdown voltage reduced as doping density varied from 1脳10 12cm-3 1脳10 17cm-3 at constant epilayer thickness of 3驴m. Hence we conclude that forward current and breakdown voltage have strong, inverse relation between epilayer thickness and doping density.
机译:数字上确定对N-GaN肖特基二极管的(I-V)特性的脱落器厚度和掺杂密度变化效应。在这项工作中,N-GaN肖特基二极管的外延厚度在3℃下改变,而掺杂密度从1÷10 12cm-3 1÷10 17cm-3变化。使用Silvaco开发的Atlas / Blaze进行了模拟工作。 SRH(Shockley-Read Hall),CVT(Lombardi模型),螺旋钻,冲击(授予模型),BGN(带隙变窄),Conmob(浓度依赖迁移率)等各种型号用于获得最佳(IV)特征N-GaN肖特基二极管。我们发现,在恒定掺杂密度的3÷M 11驴M处变化的前向偏置时,由于串联电阻的增加,前电电流由于串联电阻增加而导致的前电流降低,另一方面通过降低增加前电流增加脱落剂厚度高达3°M并增加掺杂密度1°10 17cm-3。反向偏置掺杂密度和外膜厚度的选择直接确定器件的目标反向击穿电压。由于垂直掺杂密度为1÷10 12cm-3的脱落剂厚度,由于耗尽宽度增加,击穿电压增加,而击穿电压随着掺杂密度而变化,从1°10 12cm变化3 1÷10 17cm-3以恒定的脱垂厚度为3°M。因此,我们得出结论,前电流和击穿电压具有强大,脱晶厚度和掺杂密度之间的反向关系。

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