integrated circuit packaging; plastic packaging; moulding; viscoelasticity; polymers; environmental degradation; moisture; creep; elastic constants; viscoelastic effects; epoxy molding compounds; molding compound hygro-thermo-mechanical behavior; elevated temperature environments; elevated humidity environments; polymer molding compounds; time dependent properties; temperature dependent properties; moisture dependent properties; plastic IC packages; moisture absorption; compound creep behavior; glass transition temperature; moisture content; material strain; compliance time function; shift function;
机译:片状模塑料(SMC)压缩成型过程中的各向异性粘性行为
机译:等温状态下环氧模塑化合物的等压固化收缩行为
机译:干扰内源性大麻素系统的化合物对升高的T迷宫中抗焦虑和全溶菌活性的预测行为的影响
机译:升高环境中模塑化合物的Hygro-Thermo-Machine
机译:研究模塑料的吸湿膨胀行为及其对封装的MEMS封装的影响。
机译:碳纤维片状模塑料在高温下不同应力状态下的面内蠕变行为的实验研究
机译:不同应力状态下升高温度下碳纤维片成型化合物面内蠕变行为的实验研究