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Simulation of capacitive micromachined ultrasonic transducers (cMUT) for low frequencies and silicon condenser microphones using an analytical model

机译:使用解析模型模拟低频电容式微加工超声换能器(cMUT)和硅电容传声器

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Silicon micromachining is a promising approach to realize low frequency capacitive ultrasonic transducers and condenser microphones. The construction of micromachined low frequency capacitive ultrasonic transducers or microphones, respectively, differs considerably from that used for high frequency cMUTs. This paper presents an analytical model used for the simulation. The effects of different airgap geometry and backplate perforation on frequency response and sensitivity for transducers in the audible and ultrasonic frequency range will be shown. Finally optimization criteria are discussed considering the maximum receiving sensitivity and the resonance frequency shifting of the membrane due to the effect of the backvolume.
机译:硅微机械加工是实现低频电容超声换能器和电容麦克风的一种有前途的方法。微机械加工的低频电容超声换能器或麦克风的结构与高频cMUT的结构有很大不同。本文提出了用于仿真的分析模型。将显示在听觉和超声频率范围内,不同的气隙几何形状和背板穿孔对换能器的频率响应和灵敏度的影响。最后讨论了考虑到最大接收灵敏度和由于后体积效应引起的膜共振频率偏移的优化标准。

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