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High-Resolution Transmission Electron Microscopy of Interfaces between thin Nickel Layers on Si(001) After Nickel Silicide Formation under Various Annealing Conditions

机译:在各种退火条件下形成硅化镍后,Si(001)上薄镍层之间的界面的高分辨率透射电镜

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Local structures of nickel silicide formed by heat treatment of a nickel layer sputtered on silicon (100) substrate were observed by high-resolution transmission electron microscopy. In the specimen as-sputtered and after heat treatment at 498K, a thin layer was found at the interface between Ni (Ni2Si) and the Si substrate. The layer was an initial phase of silicidation and seems to be non-fluorite type NiSi2. When annealed around 600K, the NiSi2 phase disappeared and a NiSi phase grew dominantly. At the interface of NiSi/Si, the crystal lattices appeared smooth, because the lattice mismatch between NiSi and Si was absorbed by lattice distortion within a few atomic layers of the interface. The Ni3Si2 and Ni2Si phases remaining in the grown NiSi layer were also identified by Fourier analysis of the lattice fringe
机译:通过高分辨率透射电子显微镜观察了通过对在硅(100)衬底上溅射的镍层进行热处理而形成的硅化镍的局部结构。溅射后的样品在498K热处理后,在Ni(Ni 2 Si)和Si衬底之间的界面处发现了薄层。该层是硅化的初始阶段,似乎是非萤石型的NiSi 2 。当在600K左右退火时,NiSi 2 相消失,而NiSi相占主导。在NiSi / Si的界面处,晶格显得光滑,这是因为NiSi和Si之间的晶格失配被界面的几个原子层内的晶格畸变所吸收。通过晶格条纹的傅里叶分析还可以确定残留在生长的NiSi层中的Ni 3 Si 2 和Ni 2 Si相

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