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Silicon on thin BOX: a new paradigm of the CMOSFET for low-power high-performance application featuring wide-range back-bias control

机译:薄盒上的硅:适用于低功率高性能应用的CMOSFET的新范例,具有宽范围的反向偏置控制

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We demonstrate a new MOSFET on ultra-thin BOX that allows wide-range back-bias control in low-power and high-performance applications. The back gate is effective not only to increase the drive current by about 20% in active mode but also in reduce the off-current by an order of magnitude in stand-by mode. We have also demonstrated tunable-threshold-voltage technology for devices with metal gates and ion implantation for V/sub th/ control. The target V/sub th/ for low-power applications was achieved by using ion implantation for V/sub th/ control. We propose a 6-transistor SRAM memory cell in which we obtain even more benefit from the new device structure by adding a feedback mechanism. A proposed 6-Tr SRAM memory cell is shown to dramatically improve SNM characteristics at the 65-nm technology nodes, and this effect will also apply at finer nodes.
机译:我们在超薄BOX上演示了一种新型MOSFET,该MOSFET可在低功率和高性能应用中实现宽范围的背偏置控制。背栅不仅有效地在主动模式下将驱动电流增加了约20%,而且还在待机模式下将关断电流减小了一个数量级。我们还展示了用于带有金属栅极和用于V / sub th /控制的离子注入的器件的可调阈值电压技术。通过使用离子注入实现V / sub th /控制,可实现低功率应用的目标V / sub th /。我们提出了一种六晶体管SRAM存储单元,通过添加反馈机制,我们将从新的器件结构中获得更多收益。所建议的6-Tr SRAM存储器单元显示出可以显着改善65 nm技术节点的SNM特性,并且这种效果也将适用于更精细的节点。

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