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Assembly of nanocrystalline silicon quantum dots based on a colloidal solution method

机译:基于胶体溶液法的纳米晶硅量子点组装

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In this paper we propose and develop a new bottom-up approach to the formation of silicon nanostructures based on assembly of nanocrystalline (nc) Si dots from the colloidal solution. The nc-Si dots with a diameter of 8 /spl plusmn/ 1 nm were fabricated by using VHF plasma decomposition of pulsed SiH/sub 4/ gas supply and deposited on the substrate randomly. For preparing the nc-Si dot colloidal solution, we first examined various kinds of solvent. The substrates on which the nc-Si dots deposited were immersed into the solvents, and ultra sonic treatment was applied for a few tens seconds. It was found that methanol works as a suitable solvent for nc-Si dots. The nc-Si dot solution was then condensed by evaporating the solvent a fraction. We dropped the nc-Si dot solution onto other substrates and evaporated it completely. We observed that the nc-Si dots were assembled in the solution via the lateral capillary meniscus force which works as an attractive force between the dots. Use of SiO/sub 2/ substrate with good surface wettability with the solution was found vital to have the maximum meniscus force and to have two-dimensional assembly of the dots. The evaporation speed was carefully controlled via temperature and evaporation pressure to achieve high dot density assembly. In addition, we examined the assembly of the nc-Si dots on the silicon-on-insulator substrates with various kinds of nanoscale patterning and succeeded in making the nc-Si dots cluster bridging between the nanoelectrodes with a gap of as small as 20 nm.
机译:在本文中,我们提出并开发了一种新的自下而上的方法,用于从胶体溶液中组装纳米晶体(nc)Si点的基础上形成硅纳米结构。通过使用脉冲SiH / sub 4 /供气的VHF等离子体分解,制造直径为8 / spl plusmn / 1 nm的nc-Si点,并随机沉积在基板上。为了制备nc-Si点胶体溶液,我们首先检查了各种溶剂。将其上沉积有nc-Si点的基板浸入溶剂中,并进行超声波处理数十秒钟。已发现甲醇可作为nc-Si点的合适溶剂。然后通过蒸发溶剂馏分浓缩nc-Si点溶液。我们将nc-Si点溶液滴到其他基板上并完全蒸发。我们观察到nc-Si点通过横向毛细管弯液面力在溶液中组装,该力作为点之间的吸引力。已发现使用具有良好表面润湿性的SiO / sub 2 /基材与溶液具有最大的弯液面力和点的二维组装至关重要。通过温度和蒸发压力仔细控制蒸发速度,以实现高点密度组装。另外,我们检查了绝缘体上硅衬底上具有各种纳米级图案的nc-Si点的组装,并成功地使nc-Si点簇在纳米电极之间桥接,间隙小至20 nm。 。

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