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A novel physical based model of deep-submicron CMOS transistors mismatch for Monte Carlo SPICE simulation

机译:用于Monte Carlo SPICE仿真的深亚微米CMOS晶体管失配的新型基于物理的模型

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The aim of this paper is to present a new physical based SPICE model for the deep-submicron CMOS transistors mismatch. It starts from the well known Pelgrom's area law and adds the second order effects specific to deep-submicron devices (lateral diffusion, charge sharing, channel doping fluctuation, mobility degradation, etc). The matching parameters are computed directly from the process parameters, and scaling down equations were developed and experimentally verified. The resulting matching model is independent of the SPICE level used for MOSFET modeling, being valid both for the simple Level 3 and the high complexity BSIM3 model. The model was experimentally verified for a wide range of CMOS processes (0.4 /spl mu/m, 0.35 /spl mu/m, 0.25 /spl mu/m and 0.18 /spl mu/m), showing a better accuracy in comparison with the existing matching models, that give significant errors when used for deep-submicron devices.
机译:本文的目的是为深亚微米CMOS晶体管失配提供一种新的基于物理的SPICE模型。它从众所周知的Pelgrom面积定律开始,并添加了深亚微米器件特有的二阶效应(横向扩散,电荷共享,沟道掺杂波动,迁移率降低等)。匹配参数直接从过程参数中计算得出,并且按比例缩小了方程式,并进行了实验验证。最终的匹配模型与用于MOSFET建模的SPICE级别无关,对简单的Level 3和高复杂度的BSIM3模型均有效。该模型已针对各种CMOS工艺(0.4 / spl mu / m,0.35 / spl mu / m,0.25 / spl mu / m和0.18 / spl mu / m)进行了实验验证,与现有的匹配模型,当用于深亚微米设备时会产生重大错误。

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