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Space charge behaviour in the insulation layer of a metal-base printed wiring board

机译：金属基印刷线路板的绝缘层中的空间电荷行为

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摘要

The space charge profiles of a metal-base printed wiring board were observed. The space charge of an aged sample formed the same distribution as that of copper migration inside the insulation layer. It is found that space charge observation by means of the pulsed electroacoustic method is useful for investigating the aging phenomena of a printed wiring board.

机译：观察金属基印刷线路板的空间电荷型材。老化样品的空间电荷形成了与绝缘层内部的铜迁移相同的分布。发现借助于脉冲电声方法的空间电荷观察可用于研究印刷线路板的老化现象。

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《》|1998年|P.102-105|共4页
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Fukunaga; K.; Maeno; T.;
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中图分类无线电电子学、电信技术;
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专利

1. Three-dimensional space charge observation of ion migration in a metal-base printed circuit board [J] . Fukunaga K., Maeno T., Okamoto K. IEEE Transactions on Dielectrics and Electrical Insulation . 2003,第3期

机译：金属基印刷电路板中离子迁移的三维空间电荷观察
2. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压动态平行度对多层印刷线路板差异的影响-多层印刷线路板精密粘合技术的研究IV
3. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压机动态平行性对多层印刷线板差异的影响 - 多层印刷配线板精确粘合技术研究IV
4. Space charge behaviour in the insulation layer of a metal-base printed wiring board [C] . Fukunaga K., Maeno T., Institute of Electric and Electronic Engineer IEEE International Conference on Conduction and Breakdown in Solid Dielectrics . 1998

机译：金属基印刷线板绝缘层中的空间充电行为
5. Large-area, low-cost via formation and metallization in multilayer thin film interconnection on printed wiring boards (PWB) [D] . Li, Weiping 1999

机译：印刷线路板（PWB）上多层薄膜互连中的大面积，低成本通孔形成和金属化
6. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers [O] . Pan Yi, Kui Xiao, Kangkang Ding, 2017

机译：薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
7. Space Charge Behaviour and Internal Electric Field Distribution of Printed Circuit Board Insulations [O] . Kaori FUKUNAGA, Kenji OKAMOTO, Takashi MAENO 2004

机译：空间充电行为和印刷电路板绝缘的内部电场分布
8. Insulation-Resistance Measurements of Coated and Uncoated Printed Wiring Boards [R] . Jennings, C. W. 1983

机译：涂层和未涂层印刷线路板的绝缘电阻测量

Space charge behaviour in the insulation layer of a metal-base printed wiring board

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