络合剂对废印刷线路板元器件中金属银的浸出

摘要

用络合法浸出废弃印刷线路板元器件中的金属银.主要研究了络合剂浓度、氧化剂浓度、反应温度、浸出时间对浸出效果的影响,使用电感耦合等离子体原子发射光谱法对样品进行分析.实验结果表明,废弃印刷线路板元器件中金属银的最佳浸出条件为:络合剂浓度25 g/L,氧化剂质量分数30%,反应时间2 h,反应温度308 K,浸出率达到80.95%.%The complexant was used to leach silver in components from waste printed circuit boards. It is focused on how the concen-tration of complexing agent and oxidant, reaction temperature, leaching time effect the leaching of silver. The samples were analyzed by inductively coupled plasma atomic emission spectrometry. It can be concluded that the optimum leaching conditions of silver from waste printed circuit boards' components was complexing agent concentration 25 g/L, oxidant concentration 24%, reaction time 2 h, reaction temperature 310 K.