The leaching behavior of most metals present in printed wiring boards is evaluated, aiming at its recycling by hydrometallurgy. Two leaching reagents (nitric acid and aqua regia) are compared. The effects of acid concentration, particle size of sample, leaching time, and temperature are examined. The results reveal that small particle size and a combination of both nitric acid and aqua regia are capable of dissolving most of the metals content of printed wiring boards.
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